IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermo-Mechanical Analysis of Thru-Silicon-Via Based High Density Compliant Interconnect

2007 Electronic Components and Technology Conference

Author(s): P. Arunasalam ; Fan Zhou ; H.D. Ackler ; B.G. Sammakia
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 1,179 - 1,185
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Electronic): 2377-5726
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373943
Regular:

In this paper, detailed 3D FEM thermo-mechanical analysis is performed on a chip stack that utilizes the smart Three Axis Compliant (STAC) interconnect, a TSV based ultra-high density compliant... View More

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