IEEE - Institute of Electrical and Electronics Engineers, Inc. - Characterization and Reliability Verification of Wafer-Level Hermetic Package with Nano-Liter Cavity for RF-MEMS Applications

2007 Electronic Components and Technology Conference

Author(s): Suk-Jin Ham ; Byung-Gil Jeong ; Ji-Hyuk Lim ; Kyu-Dong Jung ; Kae-Dong Baek ; Woon-Bae Kim ; Chang-Youl Moon
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 1,127 - 1,134
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373937
Regular:

Wafer-level packaging (WLP) is a very promising candidate for RF-MEMS packaging, especially in the mobile applications, due to the lower cost and higher volume throughput relative to the component... View More

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