IEEE - Institute of Electrical and Electronics Engineers, Inc. - Integrated Modeling of C4 Interconnects

2007 Electronic Components and Technology Conference

Author(s): J. Sylvestre
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 1,084 - 1,090
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373932
Regular:

An extensive methodology for the numerical modeling of C4 interconnects in flip chip organic packages is presented, with particular emphasis on the variability introduced by the manufacturing... View More

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