IEEE - Institute of Electrical and Electronics Engineers, Inc. - Improvement of JEDEC Drop Test in SJR Qualification through Alternative Test Board Design

2007 Electronic Components and Technology Conference

Author(s): Junfeng Zhao ; Fang Liu ; Xin Zhou ; Haiting Zhou ; Jianping Jing ; Mei Zhao
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 946 - 950
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373910
Regular:

Solder joint reliability (SJR) under drop impact is a big concern for hand-held device such as mobile phone and PDA. In the semiconductor industry, generally board level drop test is used to... View More

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