IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of Temperature on the Drop Reliability of Wafer-Level Chip Scale Packaged Electronics Assemblies

2007 Electronic Components and Technology Conference

Author(s): T.T. Mattila ; R.J. James ; L. Nguyen ; J.K. Kivilahti
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 940 - 945
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373909
Regular:

Electronic products experience complex loadings in ordinary daily use where electrical, thermomechanical and mechanical loadings act concurrently. Moreover, portable equipment are exposed to... View More

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