IEEE - Institute of Electrical and Electronics Engineers, Inc. - Novel Flip-Chip Bonding Technology using Chemical Process

2007 Electronic Components and Technology Conference

Author(s): Y. Yamaji ; T. Yokoshima ; H. Oosato ; N. Igawa ; Y. Tamura ; K. Kikuchi ; H. Nakagawa ; M. Aoyagi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 898 - 904
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Electronic): 2377-5726
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373905
Regular:

Reductions of bonding temperature and bonding pressure are regarded as key challenges for higher interconnection-density packages in recent years. To avoid negative factors caused by... View More

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