IEEE - Institute of Electrical and Electronics Engineers, Inc. - Cu/SnAg Double Bump Flip Chip Assembly as an Alternative of Solder Flip Chip on Organic Substrates for Fine Pitch Applications

2007 Electronic Components and Technology Conference

Author(s): Ho-Young Son ; Gi-Jo Jung ; Jun-Kyu Lee ; Joon-Young Choi ; Kyung-Wook Paik
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 864 - 871
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Electronic): 2377-5726
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373900
Regular:

Recently, the need of fine pitch flip chip interconnection has been continuously growing. In spite of this trend, solder flip chip interconnections have reached the limit in fine pitch... View More

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