IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effects of Organic Package Warpage on Microprocessor Thermal Performance

2007 Electronic Components and Technology Conference

Author(s): S.S. Too ; J. Hayward ; R. Master ; Tek-Seng Tan ; Kee-Hean Keok
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 748 - 754
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373881
Regular:

Efficient heat dissipation is a major challenge for the packaging of high power microprocessors. This paper discusses a novel lid assembly process and characterization techniques that were... View More

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