IEEE - Institute of Electrical and Electronics Engineers, Inc. - Platform of 3D Package Integration

2007 Electronic Components and Technology Conference

Author(s): Wei Chung Wang ; F. Lee ; G.L. Weng ; W. Tai ; M. Ju ; R. Chuang ; Weileun Fang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 743 - 747
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373880
Regular:

Package on package (PoP) is a package technology placing one package on top of another to integrate different functionalities while still remains a compact size. PoP offers procurement... View More

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