IEEE - Institute of Electrical and Electronics Engineers, Inc. - Crystallographic Structure and Mechanical Behaviour of SnAgCu Solder Interconnects under a Constant Loading Rate

2007 Electronic Components and Technology Conference

Author(s): Jicheng Gong ; Changqing Liu ; P.P. Conway ; V.V. Silberschmidt
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 677 - 683
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373869
Regular:

With the continuing increase of the integration density in electronics, dimensions of interconnections for electronic components have been miniaturized to a scale that is comparable to those of... View More

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