IEEE - Institute of Electrical and Electronics Engineers, Inc. - Evaluation of Micro Structured Glass Layers as Dielectric-and Passivation Material for Wafer Level Integrated Thin Film Capacitors and Resistors

2007 Electronic Components and Technology Conference

Author(s): K. Zoschke ; C. Feige ; J. Wolf ; D. Mund ; M. Topper ; O. Ehrmann ; F.-J. Schmuckle ; H. Reichl
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 566 - 573
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373852
Regular:

This work describes the integration of thin micro-structured glass layers into copper / benzocyclobutene (Cu/BCB) thin film multi layer. The glass, which is deposited by a low temperature PVD-PIAD... View More

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