IEEE - Institute of Electrical and Electronics Engineers, Inc. - Manufacturing and Characterization of Nano Silver Particles Based Thermal Interface Material

2007 Electronic Components and Technology Conference

Author(s): J. Liu ; M.O. Olorunyomi ; Xin Li ; Dongkai Shangguan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 475 - 479
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373840
Regular:

Today's technology is tuned towards faster, smaller and better efficiency. This trend has resulted in tremendous heat being generated in microelectronics components and if not properly managed, it... View More

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