IEEE - Institute of Electrical and Electronics Engineers, Inc. - Brittle Failure Mechanism of SnAgCu and SnPb Solder Balls during High Speed Ball Shear and Cold Ball Pull Tests

2007 Electronic Components and Technology Conference

Author(s): Fubin Song ; S.W.R. Lee ; K. Newman ; B. Sykes ; S. Clark
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 364 - 372
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373824
Regular:

This study investigated brittle solder joint failure mechanisms during high-speed solder ball shear and pull testing. BGA package samples with different solder alloys (Sn4.0%Ag0.5%Cu and Sn37%Pb)... View More

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