IEEE - Institute of Electrical and Electronics Engineers, Inc. - Computational Methods and High Speed Imaging Methodologies for Transient-Shock Reliability of Electronics

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007

Author(s): P. Lall
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2007
Conference Location: London, UK
Conference Date: 16 April 2007
Page(s): 1 - 13
ISBN (CD): 1-4244-1106-8
ISBN (Paper): 1-4244-1105-X
DOI: 10.1109/ESIME.2007.360065
Regular:

Product level assessment of drop and shock reliability relies heavily on experimental test methods. Prediction of drop and shock survivability is largely beyond the state- of-art. However, the use... View More

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