IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of Processing Parameters and Hygro-thermo-mechanical Stresses on the Reliability of Flip Chip Bonding RFID Tags

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007

Author(s): D.G. Yang ; E. de Bruin ; B. Kasemset ; W.D. van Driel
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2007
Conference Location: London, UK
Conference Date: 16 April 2007
Page(s): 1 - 5
ISBN (CD): 1-4244-1106-8
ISBN (Paper): 1-4244-1105-X
DOI: 10.1109/ESIME.2007.360031
Regular:

The thermal-mechanical reliability of flip chip bonding RFID packaging using low cost materials is investigated. The major processing parameters, such die bonding force, curing shrinkage, are... View More

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