IEEE - Institute of Electrical and Electronics Engineers, Inc. - Multi-Scale Modeling of Shock-Induced Failure of Polysilicon MEMS

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007

Author(s): A. Ghisi ; F. Fachin ; S. Mariani ; A. Corigliano ; S. Zerbini
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2007
Conference Location: London, UK
Conference Date: 16 April 2007
Page(s): 1 - 6
ISBN (CD): 1-4244-1106-8
ISBN (Paper): 1-4244-1105-X
DOI: 10.1109/ESIME.2007.360014
Regular:

We investigate the shock-induced stress state and possible failure mechanisms in polysilicon MEMS sensors. In case of accidental drop events, we aim at highlighting the links between drop... View More

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