IEEE - Institute of Electrical and Electronics Engineers, Inc. - The Effect of Visco-elasticity on the Result Accuracy of FEM Panel Warpage Simulations Supporting Industrial Microelectronics Packaging

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007

Author(s): S. Rzepka ; A. Muller
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2007
Conference Location: London, UK
Conference Date: 16 April 2007
Page(s): 1 - 8
ISBN (CD): 1-4244-1106-8
ISBN (Paper): 1-4244-1105-X
DOI: 10.1109/ESIME.2007.359968
Regular:

Based on measurement results of BGA substrate panel warpage, the accuracy of two FEM simulation approaches has been assessed. Relying on elastic/plastic material models, the first approach has... View More

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