IEEE - Institute of Electrical and Electronics Engineers, Inc. - Cure shrinkage characterization and its implementation into correlation of warpage between simulation and measurement

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007

Author(s): W.H. Zhu ; Guang Li ; Wei Sun ; F.X. Che ; A. Sun ; C.K. Wang ; H.B. Tan ; B.Z. Zhao ; N.H. Chin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2007
Conference Location: London, UK
Conference Date: 16 April 2007
Page(s): 1 - 8
ISBN (CD): 1-4244-1106-8
ISBN (Paper): 1-4244-1105-X
DOI: 10.1109/ESIME.2007.359966
Regular:

In this work, a new approach was proposed to characterize the cure shrinkage of EMC by using the EMC/Cu bi-layer strip specimens. The warpage of bi-layer strip was measured at different... View More

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