IEEE - Institute of Electrical and Electronics Engineers, Inc. - Molecular Dynamics Simulation for the diffusion of water in amorphous polymers examined at different Temperatures

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007

Author(s): E. Dermitzaki ; J. Bauer ; H. Walter ; H. Walter ; B. Wunderle ; B. Michel ; B. Michel ; H. Reichl
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2007
Conference Location: London, UK
Conference Date: 16 April 2007
Page(s): 1 - 9
ISBN (CD): 1-4244-1106-8
ISBN (Paper): 1-4244-1105-X
DOI: 10.1109/ESIME.2007.359925
Regular:

The authors first investigate a polymeric composite material ( epoxy resin with silicone nanoparticles) and determine its mechanical properties (coefficient of thermal expansion-CTE and Young's... View More

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