IEEE - Institute of Electrical and Electronics Engineers, Inc. - Junction Temperature During Burn-in: How Variable is It and How Can We Control It?

23rd Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Author(s): J. Forster ; C. Lopez
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2007
Conference Location: San Jose, CA, USA
Conference Date: 18 March 2007
Page(s): 168 - 173
ISBN (CD): 1-4244-09589-4
ISBN (Paper): 1-4244-0958-6
ISSN (Paper): 1065-2221
DOI: 10.1109/STHERM.2007.352418
Regular:

Electronic devices are some of the most reliable consumer products. It is taken for granted that they will "work" but a consideration of the number of millions of interconnects and the complexity... View More

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