IEEE - Institute of Electrical and Electronics Engineers, Inc. - EHD Enhanced Heat Transfer with Needle-Arrayed Electrodes

23rd Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Author(s): H.Y. Li ; R.T. Huang ; W.J. Sheu ; C.C. Wang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2007
Conference Location: San Jose, CA, USA
Conference Date: 18 March 2007
Page(s): 149 - 154
ISBN (CD): 1-4244-09589-4
ISBN (Paper): 1-4244-0958-6
ISSN (Paper): 1065-2221
DOI: 10.1109/STHERM.2007.352415
Regular:

Natural convection heat transfer enhanced by electrohydrodynamics (EHD) is experimentally investigated in this work. Four kinds of electrode arrangements on a plate fin heat sink are made... View More

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