IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal Management of High Density Very Low Profile Memory Module

23rd Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Author(s): H. Ran ; I. Mohammed
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2007
Conference Location: San Jose, CA, USA
Conference Date: 18 March 2007
Page(s): 118 - 124
ISBN (CD): 1-4244-09589-4
ISBN (Paper): 1-4244-0958-6
ISSN (Paper): 1065-2221
DOI: 10.1109/STHERM.2007.352410
Regular:

Thermal analysis is conducted on high density memory modules with 4 stack DDR2 package. Two interconnect technologies, ball stack and micro contact, are compared. Due to the high power density and... View More

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