IEEE - Institute of Electrical and Electronics Engineers, Inc. - Extracting Thermal Data from High Power MCM Packages

23rd Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Author(s): J.E. Galloway ; M. Sutton
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2007
Conference Location: San Jose, CA, USA
Conference Date: 18 March 2007
Page(s): 1 - 6
ISBN (CD): 1-4244-09589-4
ISBN (Paper): 1-4244-0958-6
ISSN (Paper): 1065-2221
DOI: 10.1109/STHERM.2007.352384
Regular:

An experimental method was presented for characterizing the thermal performance of multi-chip modules (MCMs) using different size heat sinks. A flip chip package, having a total of five active... View More

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