IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal Driven Module Placement Using Sequence-pair

APCCAS 2006. 2006 IEEE Asia Pacific Conference on Circuits and Systems

Author(s): N. Okada ; C. Kodama ; T. Sato ; K. Fujiyoshi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2006
Conference Location: Singapore, Singapore
Conference Date: 4 December 2006
Page(s): 1,871 - 1,874
ISBN (Paper): 1-4244-0387-1
DOI: 10.1109/APCCAS.2006.342204
Regular:

TThe increase of power consumption in recent VLSI chip has led to uneven thermal distribution and high temperature on the chip. This brings inappropriate distribution of wire delay and may... View More

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