IEEE - Institute of Electrical and Electronics Engineers, Inc. - An SVM Approach to Crack Shape Reconstruction in Eddy Current Testing

IEEE Instrumentation and Measurement Technology Conference

Author(s): A. Bernieri ; L. Ferrigno ; M. Laracca ; M. Molinara
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2006
Conference Location: Sorrento, Italy
Conference Date: 24 April 2006
Page(s): 2,121 - 2,126
ISBN (CD): 0-7803-9360-0
ISBN (Paper): 0-7803-9359-7
ISSN (Paper): 1091-5281
DOI: 10.1109/IMTC.2006.328502
Regular:

Nondestructive testing techniques for diagnosis in solid materials can be carried out in three steps: defect detection, location and characterization. The actual solutions allow defect detection... View More

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