IEEE - Institute of Electrical and Electronics Engineers, Inc. - Modeling of van der Waals Forces during the Assembly of Micro Devices

2006 IEEE International Conference on Automation Science and Engineering

Author(s): L. Zhang ; J. Cecil ; D. Vasquez ; J. Jones ; B. Garner
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2006
Conference Location: Shanghai, China
Conference Date: 8 October 2006
Page(s): 484 - 489
ISBN (CD): 1-4244-0311-1
ISBN (Paper): 1-4244-0310-3
DOI: 10.1109/COASE.2006.326929
Regular:

This paper discusses modeling of adhesive forces which come into play during gripping activities in the context of micro devices assembly (MDA) When complex designs for micron sized parts cannot... View More

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