IEEE - Institute of Electrical and Electronics Engineers, Inc. - Substrate Transfer: an Enabling Technology for System-in-Package Solutions

2006 Bipolar/BiCMOS Circuits and Technology Meeting

Author(s): R. Dekker ; M. Dumling ; J.-H. Fock ; J.R. Haartsen ; H.G.R. Maas ; T.M. Michielsen ; H. Pohlmann ; W. Schnitt ; A.M.H. Tombeur
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2006
Conference Location: Maastricht, Netherlands
Conference Date: 8 October 2006
Page(s): 1 - 8
ISBN (CD): 1-4244-0459-2
ISBN (Paper): 1-4244-0458-4
ISSN (Paper): 1088-9299
DOI: 10.1109/BIPOL.2006.311141
Regular:

A simple and robust technology for the transfer of circuits, processed on normal silicon wafers, to alternative substrates is presented. Substrate transfer technology (STT) is a post-processing... View More

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