IEEE - Institute of Electrical and Electronics Engineers, Inc. - Indium Bumps Investigation for the Flip-chip Assembly

2006 International Workshop and Tutorials on Electron Devices and Materials. 7th Annual

Author(s): A.M. Biktashov ; N.B. Kuzmin ; A.G. Paulish
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 2006
Conference Location: Erlagol, Altai, Russia
Conference Date: 1 July 2006
Page(s): 35 - 37
ISBN (Paper): 5-7782-0646-1
ISSN (Paper): 1815-3712
DOI: 10.1109/SIBEDM.2006.230301
Regular:

Indium bumps properties for flip-chip assembly of InAs infrared detector arrays to multiplexers have been investigated. It is shown that the indium bumps fabricated by a vacuum indium deposition... View More

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