IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Comparison of 3D Biometric Modalities

Author(s): D.L. Woodard ; T.C. Faltemier ; Ping Yan ; P.J. Flynn ; K.W. Bowyer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2006
Conference Location: New York, NY, USA, USA
Conference Date: 17 June 2006
Page(s): 57
ISBN (Paper): 0-7695-2646-2
DOI: 10.1109/CVPRW.2006.12
Regular:

Recently, researchers have focused on the use of threedimensional data as a source of distinguishing features for personal identification. In this paper, the recognition performance of three... View More

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