IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design planning for uniform thermal distribution

Proceedings. 19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems and Design

Author(s): R.M. Patrikar ; O. Peyran
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2006
Conference Location: Hyderabad, India, India
Conference Date: 3 January 2006
ISBN (Paper): 0-7695-2502-4
ISSN (Paper): 1063-9667
DOI: 10.1109/VLSID.2006.70
Regular:

Thermal distribution has become an important reliability concern for today's integrated circuits. In traditional design flows, the temperature of the chip is assumed to be uniform across the... View More

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