IEEE - Institute of Electrical and Electronics Engineers, Inc. - Using SigComp to compress SIP/SDP messages

2005 IEEE International Conference on Communications

Author(s): Haipeng Jin ; A.C. Mahendran
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Seoul, South Korea
Conference Date: 16 May 2005
Volume: 5
Page Count: 5
ISBN (Paper): 0-7803-8938-7
DOI: 10.1109/ICC.2005.1494974
Regular:

SIP and SDP are used in 3G cellular IP multimedia subsystems (IMS) to perform multimedia session setup and maintenance. However, both protocols are text-based and have large messages with sizes... View More

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