IEEE - Institute of Electrical and Electronics Engineers, Inc. - Survey and taxonomy of three-dimensional packaging approaches

15th DASC. AIAA/IEEE Digital Avionics Systems Conference

Author(s): Lyke, J.C. ; Merkel, K.G.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1996
Conference Location: Atlanta, GA, USA, USA
Conference Date: 31 October 1996
Page(s): 139 - 144
ISBN (Paper): 0-7803-3385-3
DOI: 10.1109/DASC.1996.559147
Regular:

This paper presents a survey of the field of 3-D packaging and suggests a taxonomy based on observations of an active research field and direct experience in the development of... View More

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