IEEE - Institute of Electrical and Electronics Engineers, Inc. - Impact of back side defects on feol processes and yield

2005 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop

Author(s): L. Pressley ; S. Hardin ; K. Harper ; B. Dunham ; D. Sutton ; T. Kirsch ; M. Allen ; B. Klingemann ; T. Mathews ; L. Kohler ; C. Lansford ; T. Couteau ; B. Hance ; J. Darilek ; C. Cariss ; E. Apelgren ; R. Stanley ; J. Witowski ; L. Cheung
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Munich, Germany
Conference Date: 11 April 2005
Page Count: 6
Page(s): 32 - 37
ISBN (Paper): 0-7803-8997-2
DOI: 10.1109/ASMC.2005.1438763
Regular:

Front end-of-line (FEOL) front side and back side defect investigations revealed a previously unknown back side defect mechanism that may negatively affected die sort yields. Using the AMAT... View More

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