IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design for active disassembly (DfAD): an outline for future research

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment

Author(s): B. Willems ; W. Dewulf ; J. Duflou
Sponsor(s): IEEE Comput. Soc., Tech. Comm. on Electron. and the Environ
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: New Orleans, LA, USA, USA
Conference Date: 16 May 2005
Page Count: 6
Page(s): 129 - 134
ISBN (Paper): 0-7803-8910-7
ISSN (Paper): 1095-2020
DOI: 10.1109/ISEE.2005.1437007
Regular:

Although active disassembly is an expanding research topic, no dedicated methodology for developing joining elements suitable for self-disassembling products has been described yet. Therefore,... View More

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