IEEE - Institute of Electrical and Electronics Engineers, Inc. - Packaging in the IT environment: competing challenges in the design of packaging for electronic products

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment

Author(s): J. Horbal ; M. Schaffer
Sponsor(s): IEEE Comput. Soc., Tech. Comm. on Electron. and the Environ
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: New Orleans, LA, USA, USA
Conference Date: 16 May 2005
Page Count: 3
Page(s): 93 - 95
ISBN (Paper): 0-7803-8910-7
ISSN (Paper): 1095-2020
DOI: 10.1109/ISEE.2005.1437000
Regular:

Provide an overview of packaging design considerations through modeling and testing to optimize packaging for electronic products and to provide details of the packaging challenge from an... View More

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