IEEE - Institute of Electrical and Electronics Engineers, Inc. - Comparative studies of green molding compounds for the encapsulation of Cu/low-k packages

2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Author(s): Surasit Chungpaiboonpatana ; F.G. Shi ; M. Todd ; L. Crane
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Irvine, CA, USA, USA
Conference Date: 16 March 2005
Page Count: 6
Page(s): 287 - 292
ISBN (Paper): 0-7803-9085-7
ISBN (Online): 0-7803-9086-5
ISSN (Paper): 1550-5723
DOI: 10.1109/ISAPM.2005.1432091
Regular:

The experimental results are reported on the 80 leads ETQFP module-level understanding of the performance between two green molding compound types in the packaging of 90nm Cu/low-k Si devices... View More

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