IEEE - Institute of Electrical and Electronics Engineers, Inc. - Improvement of electrical performance of anisotropically conductive adhesives

2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Author(s): Yi Li ; Kyoung-sik Moon ; C.P. Wong
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Irvine, CA, USA, USA
Conference Date: 16 March 2005
Page Count: 6
Page(s): 221 - 226
ISBN (Paper): 0-7803-9085-7
ISBN (Online): 0-7803-9086-5
ISSN (Paper): 1550-5723
DOI: 10.1109/ISAPM.2005.1432079
Regular:

To improve the electrical properties of the anisotropically conductive adhesive (ACA) joints with the potential for fine pitch interconnect, self-assembled monolayer (SAM) compounds are introduced... View More

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