IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of laser welding sequence on WIAD in packaging of dual-in-line laser modules

2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Author(s): Yaomin Lin ; F.G. Shi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Irvine, CA, USA, USA
Conference Date: 16 March 2005
Page Count: 4
Page(s): 169 - 172
ISBN (Paper): 0-7803-9085-7
ISBN (Online): 0-7803-9086-5
ISSN (Paper): 1550-5723
DOI: 10.1109/ISAPM.2005.1432071
Regular:

The tolerance of aligning a single mode fiber to a laser in a fiber pigtailed laser diode module is extremely tight, a sub micron misalignment can often lead to a significant reduction in the... View More

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