IEEE - Institute of Electrical and Electronics Engineers, Inc. - Dicing advanced materials for microelectronics

2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Author(s): A. Teng Cheung
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Irvine, CA, USA, USA
Conference Date: 16 March 2005
Page Count: 4
Page(s): 149 - 152
ISBN (Paper): 0-7803-9085-7
ISBN (Online): 0-7803-9086-5
ISSN (Paper): 1550-5723
DOI: 10.1109/ISAPM.2005.1432066
Regular:

In recent years, the volume of thinned silicon and bumped silicon wafers have increased dramatically. The push to thinner silicon is driven by smart cards and stacked dice for low profile products... View More

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