IEEE - Institute of Electrical and Electronics Engineers, Inc. - Environmentally benign materials for electronics: a review of current developments and emerging technologies

2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Author(s): J.D. Lincoln ; O.A. Ogunseitan ; J.D.M. Saphores ; J.M. Schoenung ; H. Nixon ; A.A. Shapiro
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Irvine, CA, USA, USA
Conference Date: 16 March 2005
Page Count: 5
Page(s): 139 - 143
ISBN (Paper): 0-7803-9085-7
ISBN (Online): 0-7803-9086-5
ISSN (Paper): 1550-5723
DOI: 10.1109/ISAPM.2005.1432064
Regular:

Materials used in handheld consumer electronic devices (CEDs), such as cell phones or personal digital assistants, create environmental risks both during procurement and disposal. The increasing... View More

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