IEEE - Institute of Electrical and Electronics Engineers, Inc. - Molecular vapor deposition (MVD/spl trade/) - a new method of applying moisture barriers for packaging applications

2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Author(s): M. Wanebo ; B. Kobrin ; F. Helmrich ; J. Chinn
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Irvine, CA, USA, USA
Conference Date: 16 March 2005
Page Count: 3
Page(s): 136 - 138
ISBN (Paper): 0-7803-9085-7
ISBN (Online): 0-7803-9086-5
ISSN (Paper): 1550-5723
DOI: 10.1109/ISAPM.2005.1432063
Regular:

We propose that a composite hydrophobic SAM film with 100% coverage of all exposed surfaces can be used in many advance packaging applications. For example, a SAM moisture barrier with... View More

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