IEEE - Institute of Electrical and Electronics Engineers, Inc. - Studies of fine pitch patterning by reel-to-reel processes for flexible electronic systems

2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Author(s): A. Drost ; G. Klink ; M. Feil ; K. Bock
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Irvine, CA, USA, USA
Conference Date: 16 March 2005
Page Count: 6
Page(s): 130 - 135
ISBN (Paper): 0-7803-9085-7
ISBN (Online): 0-7803-9086-5
ISSN (Paper): 1550-5723
DOI: 10.1109/ISAPM.2005.1432062
Regular:

Cost effective and high quality processes are needed for further development of flexible electronic systems. Applications of these structures are e. g. in the field of high density interconnection... View More

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