IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development of new surface finishing technology for PKG substrate with high bondability

2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Author(s): K. Tsukada
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Irvine, CA, USA, USA
Conference Date: 16 March 2005
Page Count: 5
Page(s): 110 - 114
ISBN (Paper): 0-7803-9085-7
ISBN (Online): 0-7803-9086-5
ISSN (Paper): 1550-5723
DOI: 10.1109/ISAPM.2005.1432058
Regular:

This paper describes the characteristics, development and application of the surface finishing technology for packaging substrate, especially electroless Ni/Pd/Au (nickel/palladium/gold).... View More

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