IEEE - Institute of Electrical and Electronics Engineers, Inc. - Lead free solder process development and reliability for handset application

2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Author(s): S. Zhu ; Cam Nguyen
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Irvine, CA, USA, USA
Conference Date: 16 March 2005
Page Count: 5
Page(s): 100 - 104
ISBN (Paper): 0-7803-9085-7
ISBN (Online): 0-7803-9086-5
ISSN (Paper): 1550-5723
DOI: 10.1109/ISAPM.2005.1432056
Regular:

Recent worldwide lead free activity has been driving international and US consumer electronic companies to be lead free. This paper identifies the challenges, critical issues and solutions for... View More

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