IEEE - Institute of Electrical and Electronics Engineers, Inc. - Lead-free 0201 assembly and reliability

2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Author(s): S.M. Ramkumar ; R. Newasekar ; R. Ghaffarian
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Irvine, CA, USA, USA
Conference Date: 16 March 2005
Page Count: 6
Page(s): 94 - 99
ISBN (Paper): 0-7803-9085-7
ISBN (Online): 0-7803-9086-5
ISSN (Paper): 1550-5723
DOI: 10.1109/ISAPM.2005.1432055
Regular:

The many challenges with 0201 assembly can be attributed to the solder paste volume, pad design, aperture design, board finish, type of solder paste, pick and place and reflow profile. A design of... View More

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