IEEE - Institute of Electrical and Electronics Engineers, Inc. - Electrodeposition of polyurethane adhesive for MEMS application

2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Author(s): Yuli Wang ; M. Bachman ; Guann-Pyng Li
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Irvine, CA, USA, USA
Conference Date: 16 March 2005
Page Count: 3
Page(s): 82 - 84
ISBN (Paper): 0-7803-9085-7
ISBN (Online): 0-7803-9086-5
ISSN (Paper): 1550-5723
DOI: 10.1109/ISAPM.2005.1432052
Regular:

This paper presents a polymer electrodeposition process to prepare micro-size adhesive on electrically conductive substrates, and demonstrates its application for microelectromechanical... View More

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