IEEE - Institute of Electrical and Electronics Engineers, Inc. - 3D integration of electronics and mechanics

2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Author(s): T. Peltola ; P. Mansikkamaki ; E.O. Ristolainen
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Irvine, CA, USA, USA
Conference Date: 16 March 2005
Page Count: 4
Page(s): 5 - 8
ISBN (Paper): 0-7803-9085-7
ISBN (Online): 0-7803-9086-5
ISSN (Paper): 1550-5723
DOI: 10.1109/ISAPM.2005.1432035
Regular:

Nowadays, the design is one of the key features for all consumer products. All the novel functions must be available inside fashionable covers. However, the most interesting product shapes are not... View More

Advertisement