IEEE - Institute of Electrical and Electronics Engineers, Inc. - Embedding active components inside printed circuit board (PCB) - a solution for miniaturization of electronics

2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Author(s): P. Palm ; J. Moisala ; A. Kivikero ; R. Tuominen ; A. Iihola
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Irvine, CA, USA, USA
Conference Date: 16 March 2005
Page Count: 4
Page(s): 1 - 4
ISBN (Paper): 0-7803-9085-7
ISBN (Online): 0-7803-9086-5
ISSN (Paper): 1550-5723
DOI: 10.1109/ISAPM.2005.1432034
Regular:

The continuous miniaturization of the electronics sets new requirements for the substrates, component packages and assembly technologies. Traditionally, the passive and active components are... View More

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