IEEE - Institute of Electrical and Electronics Engineers, Inc. - Novel slurry solutions for thick Cu CMP

2005 IEEE Workshop on Microelectronics and Electron Devices

Author(s): P.A. Miranda ; J.A. Imonigie ; A.L. Erbe ; A.J. Moll
Sponsor(s): IEEE Electron Devices Soc. - Boise Chapter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Boise, ID, USA
Conference Date: 15 April 2005
Page Count: 3
Page(s): 92 - 94
ISBN (Paper): 0-7803-9072-5
DOI: 10.1109/WMED.2005.1431630
Regular:

Electro-plating methods currently used to deposit Cu in through-wafer interconnect applications result in the formation of a thick Cu layer with large amounts of topographical variation. In this... View More

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