IEEE - Institute of Electrical and Electronics Engineers, Inc. - RDL manufacturing for flip chip packaging

2005 IEEE Workshop on Microelectronics and Electron Devices

Author(s): B. Williams ; D. Florence ; H. Dalal ; K. Gunturu ; M. Nelson ; C. Belisle
Sponsor(s): IEEE Electron Devices Soc. - Boise Chapter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Boise, ID, USA
Conference Date: 15 April 2005
Page(s): 28 - 31
ISBN (Paper): 0-7803-9072-5
ISSN (Electronic): 1947-3842
ISSN (Paper): 1947-3834
DOI: 10.1109/WMED.2005.1431607
Regular:

The RDL processing module provides an interconnect redistribution layer (RDL) used in flip chip packaging. The processing of this RDL module is explained in detail along with the design rules used... View More

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